Intel to support USB 3.0 alongside Thunderbolt, coming with Ivy Bridge in 2012

We were just pondering this very thing yesterday — would Intel dedicate itself to Thunderbolt and provides USB 3.0 the cold shoulder — and we have now our answer from the Santa Clara crew, albeit delivered from Beijing. The Chinese capital is the location of Intel’s currently ongoing developer conference, that is where Kirk Skaugen, VP of the corporate’s Architecture Group, assured the realm that the promise for native USB 3.0 support in Intel chipsets should be fulfilled. Not this year, mind you, however it’ll be with us in 2012 as a part of the Ivy Bridge CPU refresh. That fits AMD’s plans to support USB 3.0 in Fusion APUs, and was augmented with a robust word of endorsement from Skaugen concerning the connector’s future. He urged developers to embrace USB 3.0 on an equal footing with Intel’s proprietary Thunderbolt interconnect, describing both technologies as “complementary.” In case you say so, captain.

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This post is tagged: architecture group, chinese capital, cold shoulder, developer conference, equal footing, intel chipsets