Cellphone screens could be getting bigger , however the push to shrink all other computing components continues unabated. Invensas is definitely responsive to this, and has provide you with new, multi-die memory that promises to be both smaller in size and more capacious than existing DRAM . Called xFD, it mounts integrated circuits in a “shingle-like configuration” on top of each other to complete the trick. Such stacking increases speed while reducing power consumption because of much shorter connections between RAM dies than what’s present in multi-chip DIMM . Obviously, the memory won’t be doping up in PCs anytime soon, however the company can be showing off its new tech at IDF next week. Once you wait, there’s more RAM reading within the PR after the break.
IDF 2011 San Francisco
SAN JOSE, Calif.–(BUSINESS WIRE)–Invensas Corporation, an entirely-owned subsidiary of Tessera Technologies, Inc. (Nasdaq:TSRA), announced that it’s going to demonstrate the twin-face down (DFD) implementation of its new multi-die face-down (xFD) packaging technology on the Intel Developer’s Forum (IDF) in San Francisco September 13-15, 2011.
Due to rapid growth in multi-core processing and computing virtualization, today’s data center servers require increased DRAM capacity and function. New applications for notebook computers, tablets and smart phones also demand additional device performance balanced with battery life and reduced form-factor. A market-ready packaging platform, the Invensas™ xFD™ technology is cost-effective and improves capacity and function for DRAM devices and memory modules.
xFD is a singular multi-die, wirebond-based packaging technology that mounts integrated circuits (ICs) the other way up and staggers them in a shingle-like configuration, incorporating short wirebonds in a structure just like that of a window-BGA package. With this approach, xFD:
improves capacity and reduces overall component size with a 25 to 35 percent savings in vertical height over conventional solutions
enhances electrical performance with a 50 to 70 percent improvement in speed-bin yield because of symmetric top and bottom die performance
provides a 20 to 30 percent heat transfer advantage over conventional dual-die packages (DDPs)
Invensas xFD technology costs less to fabricate than conventional multi-die DRAM packages since it employs a parallel process flow; significantly reduces gold and other material usage; and is manufactured on existing wirebond assembly lines.
“We developed the xFD technology platform based on continued industry demand for denser, faster and less expensive DRAM solutions for servers and mobile devices,” said Simon McElrea, president of Invensas Corporation. “xFD provides single-die package performance in a multi-die configuration in addition to delivering significant thickness and thermal advantages. Unlike more complex alternatives, xFD is manufactured using existing industry manufacturing capacity, significantly reducing the associated fee, time and risk of high-volume adoption.”
Invensas will demonstrate its DFD technology in its booth at IDF.
Everything Everywhere promises ‘small-scale LTE launch’ in UK by the top of 2012
ASUS MWC teaser video hints at possible hi-res tablet display?
